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Electrochemical Corrosion Resistance and Electrical Conductivity of Three-Dimensionally Interconnected Graphene-Reinforced Cu Composites
Xue Li, Ateeq Ahmed, Byung-Sang Choi
Korean J. Met. Mater. 2021;59(11):821-828.   Published online 2021 Oct 28
DOI: https://doi.org/10.3365/KJMM.2021.59.11.821

A three-dimensionally interconnected graphene-reinforced Cu (3Di Gr-Cu) composite was synthesized using a simple two-step process technique which involves the mechanical compaction of micronsized Cu particles followed by chemical vapor deposition (CVD) at 995 ℃. The microstructural properties of pure Cu and the 3Di Gr-Cu composite were investigated by optical..... More

                           Cited By 2
Synthesis of Three-Dimensionally Interconnected Hexagonal Boron Nitride Networked Cu-Ni Composite
Zahid Hussain, Hye-Won Yang, Byung-Sang Choi
Korean J. Met. Mater. 2021;59(7):505-513.   Published online 2021 Jun 16
DOI: https://doi.org/10.3365/KJMM.2021.59.7.505

A three-dimensionally interconnected hexagonal boron nitride (3Di-hBN) networked Cu-Ni (3DihBN-Cu-Ni) composite was successfully synthesized in situ using a simple two-step process which involved the compaction of mixed Cu-Ni powders (70 wt.% Cu and 30 wt.% Ni) into a disc followed by metal-organic chemical vapor deposition (MOCVD) at 1000 oC. During..... More

                           Cited By 2
Tin Microcrystals Synthesized by Thermal Chemical Vapor Deposition in a Hydrogen-Reducing Atmosphere
Daseul Ham, Won Jeong, Hyon Chol Kang
Korean J. Met. Mater. 2019;57(6):390-395.   Published online 2019 May 16
DOI: https://doi.org/10.3365/KJMM.2019.57.6.390

We demonstrate a synthetic route to high-quality Sn microcrystals using thermal chemical vapor deposition (CVD) in a hydrogen-reducing atmosphere. During thermal CVD with SnO2 powder, a mixture of Ar and H2 (4%) gases was used as a carrier gas to maintain a hydrogen reduction environment. Hydrogen maintained a reduction environment..... More

                           Cited By 2
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