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Heat Dissipation Analysis of High-Power, Multi-Chip LED Bulbs
고 출력, 멀티 칩 LED 벌브에서 방열 거동 해석
Cheol-Hee Moon
문철희
Korean J. Met. Mater. 2018;56(3):227-234.   Published online 2018 Mar 6
DOI: https://doi.org/10.3365/KJMM.2018.56.3.227

Abstract
To ensure the reliability of high-power light-emitting diode (LED) bulbs, temperature management is very important, including reduction of the junction temperature on the LED chip and enhancing outward thermal dissipation. Simulation can be an effective tool for predicting the temperature distribution over all bulbs, which enables a quantitative analysis. In..... More

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