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Korean J. Met. Mater.
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방열 모듈 적용을 위한 Cu/Sn-3.0Ag-0.5Cu/Al 접합부의 계면 반응 및 접합강도에 미치는 후속 열처리 영향 분석
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정동익, 김가희, 김도헌, 오민철, 김건홍, 박영배
Korean J. Met. Mater.
2024;62(4):312-322. Published online 2024 Mar 28
DOI:
https://doi.org/10.3365/KJMM.2024.62.4.312
Abstract
The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu
6
Sn
5
intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag
3
Al IMC was formed at the lower SAC305/Al interface, and a black layer of.....
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파워 소자의 고속 다이 접합을 위한 5 um Cu@Sn 입자 기반 프리폼의 천이액상 소결접합 특성
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한병조, 조상호, 전강록, 이종현
Korean J. Met. Mater.
2024;62(1):12-21. Published online 2023 Dec 29
DOI:
https://doi.org/10.3365/KJMM.2024.62.1.12
Abstract
To ensure the high-temperature stability of a bondline under next-generation power devices such as SiC semiconductors, a die bonding test was performed by transient liquid-phase (TLP) sinter-bonding using a Sn-coated Cu (Cu@Sn) particle-based preform. Compared to the existing 20 min-bonding result using a 30 μm Cu@Sn particle-based preform, a 5.....
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Ti/Cu 이종 마찰 교반 용접 시 미세조직과 기계적 특성에 미치는 회전속도의 영향
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이용재, 정원기, 신세은, 이동근
Korean J. Met. Mater.
2021;59(12):886-892. Published online 2021 Nov 19
DOI:
https://doi.org/10.3365/KJMM.2021.59.12.886
Abstract
The dissimilar welding of titanium and copper by fusion welding is very difficult because the melting points of the materials are very highly different and strong brittle intermetallic compounds (IMCs) can be easily produced in welded zone and heat-affected zone, etc. Friction stir welding was employed as a type of.....
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Web of Science 3
Crossref 4
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Korean J. Met. Mater.
2021;59(9):640-651. Published online 2021 Aug 4
DOI:
https://doi.org/10.3365/KJMM.2021.59.9.640
Abstract
The paper provides experimental details of the welding and specific examples of welding aluminum welding battery cans and conductive tabs for battery pack manufacture. In this study, we provide experimental details of a process for joining dissimilar materials used in sealing battery parts. A laser brazing technique was used for.....
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Cu-6 wt% Ni-1.4 wt% Si 합금의 압연 후 기계적 성질에 미치는 시효전 처리 영향
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이상진, 신현석, 최은애, 안지혁, 최윤석, 김상식, 이재현, 한승전
Korean J. Met. Mater.
2020;58(7):488-494. Published online 2020 Jul 5
DOI:
https://doi.org/10.3365/KJMM.2020.58.7.488
Abstract
Cu-Ni-Si alloys were strengthened by Ni
2
Si intermetallic compound precipitation in a Cu matrix during aging. The Cu-6 wt% Ni-1.4wt%Si alloy was prepared by water quenching (solution treatment) or air cooling (homogenization treatment) after heating 980
o
C for 2 hours and aging at 500
o
C for 6 hours. After maintaining a.....
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Web of Science 4
Crossref 5
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Cu-3.5 wt% Ti 합금의 석출 거동에 미치는 시효 전 가공의 영향
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조민아, 최은애, 안지혁, 손영국, 김광호, 이재현, 사토시 셈보시, 한승전
Korean J. Met. Mater.
2019;57(1):10-17. Published online 2018 Dec 14
DOI:
https://doi.org/10.3365/KJMM.2019.57.1.10
Abstract
Cu-Ti alloys were strengthened by Cu4Ti intermetallic compound precipitation in a Cu matrix during aging. The Cu-3.5 wt% Ti(Cu-4.6 at% Ti) alloys without deformation and with uniform and non-uniform deformation were aged at 450 oC for various times after solution treatment at 885 oC. The uniformly and non-uniformly deformed alloys.....
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Web of Science 10
Crossref 9
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Korean J. Met. Mater.
2018;56(5):366-374. Published online 2018 May 8
DOI:
https://doi.org/10.3365/KJMM.2018.56.5.366
Abstract
This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/ Al
2
O
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joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and.....
More
Crossref 13
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Cu-Sn계 솔더와 기판 사이의 Ni층의 두께와 열처리 시간에 따른 금속간화합물의 기계적 특성
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김이슬, 권지혜, 유다영, 박성규, 이다정, 이동윤
Korean J. Met. Mater.
2017;55(3):165-172. Published online 2017 Mar 3
DOI:
https://doi.org/10.3365/KJMM.2017.55.3.165
Abstract
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion.....
More
Crossref 2
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허민혁, 강남현, 박성훈, 김준기, 홍원식
Korean J. Met. Mater.
2016;54(12):908-915. Published online 2016 Dec 5
DOI:
https://doi.org/10.3365/KJMM.2016.54.12.908
Abstract
The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly.....
More
Crossref 4
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