Korean J. Met. Mater. 2017;55(3):165-172. Published online 2017 Mar 3
DOI:
https://doi.org/10.3365/KJMM.2017.55.3.165
Abstract
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion.....
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