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Kerfless Si Wafering Using Al Metal Paste, Epoxy and Ni Electroplating as Stress-Induced Layer
Young Joon Cho, Hyo Sik Chang
Korean J. Met. Mater. 2022;60(5):370-375.   Published online 2022 Apr 22
DOI: https://doi.org/10.3365/KJMM.2022.60.5.370

Abstract
Kerfless wafering is a beneficial technique that enhances the cost effectiveness of crystalline silicon (c-Si) solar cells, preventing silicon (Si) waste during diamond sawing. This study compared the advantages of three stress layers for kerfless wafering: aluminum (Al) paste, epoxy-, and electroplated nickel (Ni). These materials demonstrated the ability to..... More

                        
Separation of Pd(II) and Zn(II) by Solvent Extraction using Commercial Extractants from Hydrochloric Acid Leaching Solution of Cemented Pd from Spent Electroplating Solutions
도금폐액에 함유된 팔라듐의 아연치환물 염산침출액에서 상용화추출제를 이용한 용매추출로 팔라듐(II)과 아연(II)의 분리
Si Jeong Song, Viet Nhan Hoa Nguyen, Man Seung Lee
송시정, Viet Nhan Hoa Nguyen, 이만승
Korean J. Met. Mater. 2022;60(3):188-197.   Published online 2022 Feb 8
DOI: https://doi.org/10.3365/KJMM.2022.60.3.188

Abstract
The demand for palladium (Pd) has increased and this has made it necessary to recover pure Pd from diverse secondary resources. To recover the small amount of Pd(II) present in spent electroplating solutions, Pd(II) is concentrated by cementation with zinc metal. In this work, a hydrometallurgical process consisting of leaching..... More

                        
Separation of Pd(II) and Zn(II) from Sulfuric Acid Solution by Commercial Extractants
황산용액에서 상용화 추출제에 의한 팔라듐(II)과 아연(II)의 분리
Si Jeong Song, Viet Nhan Hoa Nguyen, Man Seung Lee
송시정, Viet Nhan Hoa Nguyen, 이만승
Korean J. Met. Mater. 2022;60(2):132-140.   Published online 2022 Jan 12
DOI: https://doi.org/10.3365/KJMM.2022.60.2.132

Abstract
Spent electroplating solutions contain a small amount of Pd(II). This Pd(II) can be concentrated by cementation with zinc metal powder. In order to recover pure palladium, a hydrometallurgical process consisting of leaching followed by solvent extraction was developed in this work. First, suitable extractants for the selective extraction of Pd(II)..... More

                           Cited By 1
Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
JGB 첨가제에 의한 동박의 미세구조변화와 전기적 특성
Tae-Gyu Woo, Il-Song Park
우태규, 박일송
Korean J. Met. Mater. 2021;59(6):404-411.   Published online 2021 May 26
DOI: https://doi.org/10.3365/KJMM.2021.59.6.404

Abstract
Extremely thin film high quality copper foil is required to ensure high performance in electronics and slimness in secondary batteries. During the electroplating of copper foil, Janus Green B(JGB) and Collagen were introduced as additives to the electrolytes to study their effects. The structural and electrical properties of the electroplated..... More

                           Cited By 1
Initial Behavior of Additives and Mechanical Properties of Copper Foils on High Current Density
고전류밀도에서의 첨가제 초기 거동 및 동박의 기계적 특성
Tae-Gyu Woo, Jong-Jae Park, Il-Song Park
우태규, 박종재, 박일송
Korean J. Met. Mater. 2021;59(5):304-313.   Published online 2021 Apr 6
DOI: https://doi.org/10.3365/KJMM.2021.59.5.304

Abstract
In this study, we studied the surface and mechanical properties of multiple additives as well as the initial plating properties of individual additives. With the individual additive groups, copper crystals tended to converge at a stage above the critical amount of additive. When chloride ions were added, large crystals formed..... More

                           Cited By 1
Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
Sn 도금을 통한 PCB 기판상의 솔더 범프 제작 및 미세조직 분석
Sang-Hyeok Kim, Seong-Jin Kim, Han-Kyun Shin, Hyun Park, Cheol-Ho Heo, Seongjae Moon, Hyo-Jong Lee
김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater. 2021;59(4):233-238.   Published online 2021 Mar 24
DOI: https://doi.org/10.3365/KJMM.2021.59.4.233

Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More

                        
Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
고전류밀도에서 유기첨가제에 의한 구리 전착층의 전기적 특성 변화
Tae-Gyu Woo, Il-Song Park
우태규, 박일송
Korean J. Met. Mater. 2020;58(1):41-48.   Published online 2019 Dec 12
DOI: https://doi.org/10.3365/KJMM.2020.58.1.41

Abstract
Electroplating has many economic advantages in producing copper foils. The easiest way to manufacture electroplated copper foil with various properties is to add appropriate additives. This study evaluated the surface properties, mechanical and electrical properties of copper foil electroplated in electrolytes containing the leveler JGB (Janus Green B). When the..... More

                           Cited By 1
Optimization of Electrochemical Variables of Pulse-Reverse Electroplating in Trivalent Chromium Bath to Enhance the Corrosion Resistance of Chromium Film
3가 크롬 도금욕에서 펄스 도금의 전기화학적 변수 최적화를 통한 크롬 도금막의 내식성 향상 연구
Chaewon Lim, Dongwook Lim, Bonil Ku, Sang Eun Shim, Sung-Hyeon Baeck
임채원, 임동욱, 구본일, 심상은, 백성현
Korean J. Met. Mater. 2019;57(10):641-647.   Published online 2019 Sep 6
DOI: https://doi.org/10.3365/KJMM.2019.57.10.641

Abstract
Electroplating chromium films in a trivalent chromium bath has been extensively investigated as a replacement for the conventional hexavalent chromium bath. However, commercialization of the trivalent chromium method has been hindered because the resulting chromium films exhibit inferior mechanical properties compared to hexavalent chromium coated film. In this study, we..... More

                        
Effect of Gelatin and Chloride Ions on the Mechanical Properties and Microstructural Evolution of Copper Foil
젤라틴 및 염소이온 첨가에 의한 구리 박막의 미세조직 및 기계적 특성 고찰
Tae-Gyu Woo, Man-Hyung Lee, Kyeong-Won Seol
우태규, 이만형, 설경원
Korean J. Met. Mater. 2018;56(7):518-523.   Published online 2018 Jul 5
DOI: https://doi.org/10.3365/KJMM.2018.56.7.518

Abstract
This study investigated the crystal structure and mechanical properties of copper foil electroplated by adjusting gelatin and chloride ions from 0 to 100 ppm. There was increased formation of spherical crystals and surface roughness on the surface of the electroplated layer when the gelatin was added, and the direction of..... More

                        
Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper
구리 전해도금 변수의 기계적 특성 및 표면 특성에 미치는 주 효과 분석
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
우태규, 박일송, 설경원
Korean J. Met. Mater. 2018;56(6):459-464.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.459

Abstract
Electroplated copper has been used as wiring in electronic circuit boards and as cathode materials for secondary batteries, and its usage has expanded into the construction industry because of its convenient production and high economic value. During the electroplating process, various parameters, such as crystal phase and size, can affect..... More

                           Cited By 1
Effect of Via Pitch on the Extrusion Behavior of Cu-filled TSV
Seho Kee, Wonjoong Kim, Jaepil Jung, Minhyung Choi
Korean J. Met. Mater. 2018;56(6):449-458.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.449

Abstract
In this study, the extrusion behavior of Cu fill material in a through-Si-via (TSV) subjected to thermal loading was investigated. The Cu filling of the TSV was accomplished using pulse periodic reverse (PPR) electroplating. To study the extrusion, TSVs of varying via pitch were filled with Cu by electroplating. Defect-free Cu..... More

                           Cited By 3
Electronic Materials
The Effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) Additives on the Surface Morphology and Mechanical Properties of Electrolytic Copper Foil
전해 동박의 표면 형상 및 기계적 물성에 미치는 SPS 첨가제 영향
Tae-Gyu Woo
우태규
Korean J. Met. Mater. 2016;54(9):681-687.   Published online 2016 Sep 5
DOI: https://doi.org/10.3365/KJMM.2016.54.9.681

Abstract
In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there..... More

         Cited By 5
Corrosion & Surface Treatment
Effect of Potassium Persulfate on Current Efficiency for Gold Plating
금도금의 전류효율에 미치는 과황산칼륨 첨가의 영향
Injoon Son, Ho-Sang Sohn, Kyung Tae Kim
손인준, 손호상, 김경태
Korean J. Met. Mater. 2016;54(9):652-658.   Published online 2016 Sep 5
DOI: https://doi.org/10.3365/KJMM.2016.54.9.652

Abstract
In this study, the effect of potassium persulfate on current efficiency for gold plating was investigated using electrochemical techniques. The current efficiency in the low-current-density range greatly decreased when potassium persulfate was added to the gold plating solution. However, the current efficiency in the high-current-density range did not change with..... More

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