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Kerfless Si Wafering Using Al Metal Paste, Epoxy and Ni Electroplating as Stress-Induced Layer
Young Joon Cho, Hyo Sik Chang
Korean J. Met. Mater. 2022;60(5):370-375.   Published online 2022 Apr 22
DOI: https://doi.org/10.3365/KJMM.2022.60.5.370

Abstract
Kerfless wafering is a beneficial technique that enhances the cost effectiveness of crystalline silicon (c-Si) solar cells, preventing silicon (Si) waste during diamond sawing. This study compared the advantages of three stress layers for kerfless wafering: aluminum (Al) paste, epoxy-, and electroplated nickel (Ni). These materials demonstrated the ability to..... More

                
Effect of Co-Solvent Percentages on the Exfoliation Rate of NiTe<sub>2</sub> Thin Film for Transparent Electrodes
혼합용매 비율이 투명전극 용 NiTe2 박막의 박리에 미치는 영향
Jun Ho Lee, Ho Jun Park, Chae Eun Im, Jong Gyeom Kim, Dong Eun Gu, Suk Jun Kim
이준호, 박호준, 임채은, 김종겸, 구동은, 김석준
Korean J. Met. Mater. 2021;59(7):481-490.   Published online 2021 Jun 16
DOI: https://doi.org/10.3365/KJMM.2021.59.7.481

Abstract
We attempted to maximize the transmittance of 2D NiTe2 thin film using the liquid-phase exfoliation (LPE) process to confirm the applicability of NiTe2 as a transparent electrode. The LPE process, using a co-solvent of organic solvent and water, is a stable and efficient method of increasing transmittance at low cost...... More

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