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Heat Dissipation Analysis of High-Power, Multi-Chip LED Bulbs
고 출력, 멀티 칩 LED 벌브에서 방열 거동 해석
Cheol-Hee Moon
Korean J. Met. Mater. 2018;56(3):227-234.   Published online 2018 Mar 6
DOI: https://doi.org/10.3365/KJMM.2018.56.3.227

To ensure the reliability of high-power light-emitting diode (LED) bulbs, temperature management is very important, including reduction of the junction temperature on the LED chip and enhancing outward thermal dissipation. Simulation can be an effective tool for predicting the temperature distribution over all bulbs, which enables a quantitative analysis. In..... More

Thermal Conductivity of Double-Layer Clad Metals along the Thickness Direction Using Light Flash Analysis and Estimation Models
2층금속 클래드메탈의 두께방향으로 섬광법 적용 열전도도 측정과 예측모델 연구
Jong-Gu Kim, Jae-Hoon Ju, Dong-Yong Kim, Sung Hyuk Park, Young-Rae Cho
김종구, 주재훈, 김동용, 박성혁, 조영래
Korean J. Met. Mater. 2017;55(7):523-528.   Published online 2017 Jul 4
DOI: https://doi.org/10.3365/KJMM.2017.55.7.523

Heat transfer plays a critical role in the fabrication of high efficiency electronic devices. Double-layer clad metals consisting of stainless steel (STS) and aluminum (Al) alloy were fabricated by the roll bonding process, and their thermal conductivity was calculated using measurements of density, specific heat, and thermal diffusivity obtained by..... More

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