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Numerical Investigation of the Self-Propagation of Intermetallic Reaction Waves in Nanoscale Aluminum/Nickel Reactive Multilayer Foils
Kyoungjin Kim
Korean J. Met. Mater. 2019;57(2):97-107.   Published online 2019 Jan 8
DOI: https://doi.org/10.3365/KJMM.2019.57.2.97

Among several candidates for nanoenergetic materials and systems, nanoscale reactive multilayer foils (NRMF) or bimetallic nano-laminates are highly promising candidates. They provide the highly desirable pyrotechnical properties of high energy density and reaction sensitivity as well as flexible tunability. They could be useful in various fields of explosive and propellant..... More

                           Cited By 5
Phase-field Modeling of Precipitate Behavior in RPV Steel Using CALPHAD Database
Kunok Chang, Junhyun Kwon, Gyeong-Geun Lee
Korean J. Met. Mater. 2018;56(6):472-478.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.472

We developed a multi-scale modeling framework using the thermodynamic UW1 database of the Fe-Mn-Ni-Si quaternary system. To obtain input data for the phase-field model, such as mobility and interfacial energy data, we used DICTRA software and the TC-PRISMA package with the commercial TCFE8 and MOBFE3 databases. Using the developed framework,..... More

                           Cited By 1
A Study on the Variation in Tensile Ductility of Porous Sintered Iron
다공성 소결 순철에서 인장연성의 변화에 관한 연구
Jae-Young Jung, Ho-Sang Sohn
정재영, 손호상
Korean J. Met. Mater. 2018;56(1):34-39.   Published online 2018 Jan 1
DOI: https://doi.org/10.3365/KJMM.2018.56.1.34

A model based on Irwin's approach to elastic-plastic deformation was applied to predict the tensile ductility of a sintered iron. The evaluation of this model using experimental results for porous sintered iron showed that tensile ductility depends not only on the pore volume fraction, but also the pore size and..... More

Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측
Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
허민혁, 강남현, 박성훈, 김준기, 홍원식
Korean J. Met. Mater. 2016;54(12):908-915.   Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.908

The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly..... More

         Cited By 4
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