| Home | E-Submission/Review | Sitemap | Editorial Office |  
top_img
Korean Journal of Metals and Materials Search > Browse Articles > Search



Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
전류밀도에 따른 플립칩 Sn-Ag 솔더 범프의 Electromigration 손상기구 분석
Gahui Kim, Kirak Son, Gyu-Tae Park, Young-Bae Park
김가희, 손기락, 박규태, 박영배
Korean J. Met. Mater. 2017;55(11):798-805.   Published online 2017 Oct 31
DOI: https://doi.org/10.3365/KJMM.2017.55.11.798

Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 103 A/cm2 at 150 ℃. The EM failure times at 5.0 × 103 A/cm2 were around 11 times longer than at..... More

         Cited By 1
1 |
E-Submission
Email Alert
Author's Index
Specialties
Impact factor
The Korean Institute of Metals and Materials
SCImago Journal & Country Rank
Scopus
GoogleScholar
Similarity Check
Crossref Cited-by Linking
KOFST
COPE
Editorial Office
The Korean Institute of Metals and Materials
6th Fl., Seocho-daero 56-gil 38, Seocho-gu, Seoul 06633, Korea
TEL: +82-2-557-1071   FAX: +82-2-557-1080   E-mail: metal@kim.or.kr
About |  Browse Articles |  Current Issue |  For Authors and Reviewers
Copyright © The Korean Institute of Metals and Materials.                 Developed in M2PI