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Fabricating and Probing Forsterite Li-ion Battery Anode Electrodes
Forsterite 리튬 이온 배터리 음극 제조 및 전기화학적 반응 탐침
Dong-Ju Kim, Byoung-Nam Park
김동주, 박병남
Korean J. Met. Mater. 2022;60(11):851-857.   Published online 2022 Oct 31
DOI: https://doi.org/10.3365/KJMM.2022.60.11.851

Abstract
In an effort to minimize irreversible capacity loss and volume expansion, research on Si nanocomposite materials with a SiOx/Mg2SiO4/SiOx structure through a magnesiothermic reduction process (MTR) has attracted much attention from researchers. Mg2SiO4(forsterite) has been shown to improve the initial coulombic efficiency (ICE) by minimizing the irreversible capacity loss due..... More

                   Web of Science 1
Nano Silicon Composite with Gelatin/Melamine Derived N-doped Carbon as an Efficient Anode Material for Li-ion Batteries
Venugopal Nulu
Korean J. Met. Mater. 2021;59(11):802-812.   Published online 2021 Oct 28
DOI: https://doi.org/10.3365/KJMM.2021.59.11.802

Abstract
Silicon (Si) has a high theoretical capacity and low working potential vs. Li/Li+, and has been investigated as the most capable negative electrode material for lithium-ion batteries (LIBs). However, Si undergoes significant volume changes during the Li+ alloying/ dealloying processes, leading to unstable cycle life and limiting its practical applicability..... More

                   Web of Science 2  Crossref 2
Cleavage Dicing Mechanics in Silicon Wafers
실리콘 웨이퍼의 그리비지 다이싱 역학
Seong-Min Lee, Yeon-Wook Kim
이성민, 김연욱
Korean J. Met. Mater. 2019;57(11):689-694.   Published online 2019 Nov 5
DOI: https://doi.org/10.3365/KJMM.2019.57.11.689

Abstract
This article details how effectively dicing damage of silicon wafers can be mechanically minimized by appropriate laser-induced groove formation prior to wafer separation. Various laser dicing factors, such as the laser-control power, the scan rate and the scan number of the laser beam, were estimated to determine the optimum groove..... More

                   Web of Science 2  Crossref 1
Investigation of the Mechanical/Thermal Properties of Nano-Scale Silicon Nitride Membranes
나노스케일 질화규소 멤브레인의 기계적, 열적 특성 분석
Yong Ju Jang, Hyeon-Jin Shin, Seong Ju Wi, Ha Neul Kim, Gi Sung Lee, Jinho Ahn
장용주, 신현진, 위성주, 김하늘, 이기성, 안진호
Korean J. Met. Mater. 2019;57(2):124-129.   Published online 2019 Jan 9
DOI: https://doi.org/10.3365/KJMM.2019.57.2.124

Abstract
In micro/nano electro-mechanical system, silicon nitride (SiNx) membrane has been widely used in sensors, energy harvesting and optical filters because of its mechanical/chemical stability. However, it is necessary to verify mechanical and thermal properties of nanoscale SiNx membranes to ensure the desirable reliability and durability of a device because the..... More

                   Web of Science 5  Crossref 5
Mechanical Properties of Liquid Phase Sintered SiC Materials by the Addition of Unimodal and Bimodal Particles
단일 크기와 이중 크기의 탄화규소 입자를 이용한 액상소결 탄화규소의 기계적 특성
Jun Yeab Lee, Sang Pill Lee, Jin Kyung Lee, Moon Hee Lee, Seung Kuk Hwang
이준엽, 이상필, 이진경, 이문희, 황승국
Korean J. Met. Mater. 2019;57(1):60-66.   Published online 2018 Dec 14
DOI: https://doi.org/10.3365/KJMM.2019.57.1.60

Abstract
Both the mechanical properties and probability distribution of liquid phase sintered SiC (LPS-SiC) materials were investigated, based on a detailed analysis of their microstructures. In particular, the effect of the starting sizes of SiC particles on the characterization of LPS-SiC materials was evaluated. LPS-SiC materials were fabricated with a constant..... More

                   Web of Science 2  Crossref 2
Effect of Via Pitch on the Extrusion Behavior of Cu-filled TSV
Seho Kee, Wonjoong Kim, Jaepil Jung, Minhyung Choi
Korean J. Met. Mater. 2018;56(6):449-458.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.449

Abstract
In this study, the extrusion behavior of Cu fill material in a through-Si-via (TSV) subjected to thermal loading was investigated. The Cu filling of the TSV was accomplished using pulse periodic reverse (PPR) electroplating. To study the extrusion, TSVs of varying via pitch were filled with Cu by electroplating. Defect-free Cu..... More

                   Crossref 4
A Study of Silicon Crystallization Dependence upon Silicon Thickness in Aluminum-induced Crystallization Process
Doo Won Lee, Muhammad Fahad Bhopal, Soo Hong Lee
Korean J. Met. Mater. 2018;56(5):400-405.   Published online 2018 May 8
DOI: https://doi.org/10.3365/KJMM.2018.56.5.400

Abstract
Aluminum-induced crystallization(AIC) is one of the ways to improve characteristics of thin-film poly-crystalline (TFPC) silicon solar cell since it shows large grain size and good properties for TFPC silicon solar cell. In AIC process, aluminum is firstly deposited on foreign substrate. Then, silicon is deposited on aluminum. Annealing was done..... More

       Crossref 1
Design of a Silicon Fresnel Lens for Optimized Light Coupling in a Transmitter Optical Subassembly
실리콘 프레넬 렌즈 기반 트랜스미터 광모듈의 광정렬 설계 및 특성 향상 연구
In Yup Hwang, Jun-Seok Ha, Sang-Wan Ryu
황인엽, 하준석, 류상완
Korean J. Met. Mater. 2017;55(11):813-818.   Published online 2017 Oct 31
DOI: https://doi.org/10.3365/KJMM.2017.55.11.813

Abstract
The silicon microlens is a key element in advanced optical packaging. However, the difficulty of its fabrication process and low yield have hindered the development of an silicon lens based optical device module. A silicon Fresnel lens was studied using ray tracing optical simulation, because its small sagittal height allows..... More

    
Design of Silicon Plano Convex Lens for Optimized Light Coupling Between Laser Diodes and Single Mode Optical Fiber
레이저 다이오드와 단일 모드 광섬유 간의 광 결합 최적화를 위한 실리콘 플라노 컨벡스 렌즈 설계
In Yup Hwang, Jongoh Park, Jun-Seok Ha, Sang-Wan Ryu
황인엽, 박종오, 하준석, 류상완
Korean J. Met. Mater. 2017;55(4):274-283.   Published online 2017 Apr 6
DOI: https://doi.org/10.3365/KJMM.2017.55.4.274

Abstract
High speed and large capacity optical communication networks are needed to meet the demands of increased traffic being created by mobile services. Advanced optical communication systems are based on high performance optical device modules that have small footprints and low power consumption. A microlens with a short coupling length and..... More

    
Electronic Materials
Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers with Different Thicknesses
다이싱 속도 변화가 두께가 차별화된 반도체 웨이퍼의 칩핑 손상에 미치는 영향
Seong-Min Lee
이성민
Korean J. Met. Mater. 2016;54(8):598-604.   Published online 2016 Aug 5
DOI: https://doi.org/10.3365/KJMM.2016.54.8.598

Abstract
This work details how the sawing velocity influences the chipping damage of semiconductor wafers with different thicknesses during wafer separation. The experimental result shows that at a sawing velocity higher than 60000 rpm, in thinner wafers the magnitude of chipping damage more strongly depends on the revolving velocity of the..... More

       Crossref 3
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