Korean J. Met. Mater. 2019;57(11):689-694. Published online 2019 Nov 5
DOI:
https://doi.org/10.3365/KJMM.2019.57.11.689
Abstract
This article details how effectively dicing damage of silicon wafers can be mechanically minimized by appropriate laser-induced groove formation prior to wafer separation. Various laser dicing factors, such as the laser-control power, the scan rate and the scan number of the laser beam, were estimated to determine the optimum groove.....
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