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Effect of Interfacial Intermetallic Compounds Morphology on Mechanical Properties of Laser Brazing of Aluminum to Steel
Kwang-Hyeon Lee, Su-Jin Lee, In-Duck Park, Kwang-Deok Choi, Chung-Yun Kang, Jeong Suh, Tae-Jin Yoon
Korean J. Met. Mater. 2021;59(9):640-651.   Published online 2021 Aug 4
DOI: https://doi.org/10.3365/KJMM.2021.59.9.640

Abstract
The paper provides experimental details of the welding and specific examples of welding aluminum welding battery cans and conductive tabs for battery pack manufacture. In this study, we provide experimental details of a process for joining dissimilar materials used in sealing battery parts. A laser brazing technique was used for..... More

                        
Microstructural Changes of 22Cr-9Mo-3Fe-4Nb Ni-Base Superalloy during Creep
Youngseok Song, Jinik Suk, Chung-Yun Kang
Korean J. Met. Mater. 2017;55(7):486-491.   Published online 2017 Jul 4
DOI: https://doi.org/10.3365/KJMM.2017.55.7.486

Abstract
A new Ni based superalloy is considered as bucket material because of high fatigue resistance with fine grain. However a bucket is usually exposed to high temperature for a long time, so creep rupture tests were conducted to understand the microstructure evolution during creep deformation under various stresses at temperatures..... More

         Cited By 1
Effect of Bonding Pressure and Bonding Time on the Tensile Properties of Cu-Foam / Cu-Plate Diffusion Bonded Joint
Cu foam / Cu plate 간 고상확산접합부의 인장성질에 미치는 접합압력과 유지시간의 영향
Sang-Ho Kim, Hoe-Jun Heo, Tae-Jin Yoon, Chung-Yun Kang
김상호, 허회준, 윤태진, 강정윤
Korean J. Met. Mater. 2016;54(12):899-907.   Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.899

Abstract
Open cell Cu foam, which has been widely utilized in various industries because of its high thermal conductivity, lightweight and large surface area, was successfully joined with Cu plate by diffusion bonding. To prevent excessive deformation of the Cu foam during bonding process, the bonding pressure should be lower than..... More

         Cited By 1
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