Abstract
The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu₆Sn₅ intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag₃Al IMC was formed at the lower SAC305/Al interface, and a black layer of..... More

Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 10³ A/cm² at 150 ℃. The EM failure times at 5.0 × 10³ A/cm² were around 11 times longer than at..... More