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Kerfless Si Wafering Using Al Metal Paste, Epoxy and Ni Electroplating as Stress-Induced Layer
Young Joon Cho, Hyo Sik Chang
Korean J. Met. Mater. 2022;60(5):370-375.   Published online 2022 Apr 22
DOI: https://doi.org/10.3365/KJMM.2022.60.5.370

Abstract
Kerfless wafering is a beneficial technique that enhances the cost effectiveness of crystalline silicon (c-Si) solar cells, preventing silicon (Si) waste during diamond sawing. This study compared the advantages of three stress layers for kerfless wafering: aluminum (Al) paste, epoxy-, and electroplated nickel (Ni). These materials demonstrated the ability to..... More

                        
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