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Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate
Cu-Sn계 솔더와 기판 사이의 Ni층의 두께와 열처리 시간에 따른 금속간화합물의 기계적 특성

Yiseul Kim, Jeehye Kwon, Dayoung Yoo, Sungkyu Park, Dajeong Lee, Dongyun Lee
김이슬, 권지혜, 유다영, 박성규, 이다정, 이동윤

Korean J. Met. Mater. 2017;55(3):165-172. Published online 2017 Mar 3
DOI: https://doi.org/10.3365/KJMM.2017.55.3.165

Abstract
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion..... More

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