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Effects of Heat Treatment and Thermal Cycle Conditions on the Bonding Strength and Interfacial Characteristics of Electroplated Cr/Electroplated Ni-P Coatings
열처리 및 열 사이클 조건에 따른 전해 Cr/전해 Ni-P 도금의 접합강도 평가 및 계면분석
Jina Lee, Kirak Son, Myung-Hee Choi, Kyu Hwan Lee, Young-Bae Park
이진아, 손기락, 최명희, 이규환, 박영배
Korean J. Met. Mater. 2018;56(4):280-288.   Published online 2018 Apr 5
DOI: https://doi.org/10.3365/KJMM.2018.56.4.280

Abstract
The effects of heat treatment and thermal cycle conditions on the bonding strength and interfacial characteristics of electroplated Cr/electroplated Ni-P coatings were systematically evaluated. With step1 samples, heat treatment was performed at 750 oC for 6 hours after successive electroplating of Ni-P and Cr layers. With step2 samples, 1st heat..... More

      
Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
전류밀도에 따른 플립칩 Sn-Ag 솔더 범프의 Electromigration 손상기구 분석
Gahui Kim, Kirak Son, Gyu-Tae Park, Young-Bae Park
김가희, 손기락, 박규태, 박영배
Korean J. Met. Mater. 2017;55(11):798-805.   Published online 2017 Oct 31
DOI: https://doi.org/10.3365/KJMM.2017.55.11.798

Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 103 A/cm2 at 150 ℃. The EM failure times at 5.0 × 103 A/cm2 were around 11 times longer than at..... More

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