Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
Gahui Kim, Kirak Son, Gyu-Tae Park, Young-Bae Park
Korean J. Met. Mater.. 2017;55(11):798-805.   Published online 2017 Oct 31     DOI: https://doi.org/10.3365/KJMM.2017.55.11.798
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Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps
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