Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
Korean J. Met. Mater.. 2018;56(6):459-464.   Published online 2018 Jun 4     DOI:
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Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
Tae-Gyu Woo, Il-Song Park
Korean Journal of Metals and Materials.2020; 58(1): 41.     CrossRef