![]() |
Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
Korean J. Met. Mater.. 2016;54(12):908-915. Published online 2016 Dec 5 DOI: https://doi.org/10.3365/KJMM.2016.54.12.908
|
Citations to this article as recorded by
Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
Journal of Welding and Joining.2021; 39(1): 89. CrossRef Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump
Gyu-Tae Park, Byeong-Rok Lee, Kirak Son, Young-Bae Park
Electronic Materials Letters.2019; 15(2): 149. CrossRef The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders
Yujin Park, Jung-Hwan Bang, Chul Oh, Won Hong, Namhyun Kang
Metals.2017; 7(12): 540. CrossRef
|