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Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
Korean J. Met. Mater.. 2016;54(12):908-915. Published online 2016 Dec 5 DOI: https://doi.org/10.3365/KJMM.2016.54.12.908
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Citations to this article as recorded by
 Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
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Electronic Materials Letters.2019; 15(2): 149. CrossRef The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders
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