Cleavage Dicing Mechanics in Silicon Wafers
Seong-Min Lee, Yeon-Wook Kim
Korean J. Met. Mater.. 2019;57(11):689-694.   Published online 2019 Nov 5     DOI:
Citations to this article as recorded by Crossref logo
Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique
Seong-Min Lee, Yeon-Wook Kim
Journal of Mechanical Science and Technology.2020; 34(2): 675.     CrossRef