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Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
Tae-Gyu Woo, Il-Song Park
Korean J. Met. Mater.. 2020;58(1):41-48. Published online 2019 Dec 12 DOI: https://doi.org/10.3365/KJMM.2020.58.1.41
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Citations to this article as recorded by
 Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
Tae-Gyu Woo, Il-Song Park
Korean Journal of Metals and Materials.2021; 59(6): 404. CrossRef
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