Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
Tae-Gyu Woo, Il-Song Park
Korean J. Met. Mater.. 2020;58(1):41-48.   Published online 2019 Dec 12     DOI: https://doi.org/10.3365/KJMM.2020.58.1.41
Citations to this article as recorded by Crossref logo
Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
Tae-Gyu Woo, Il-Song Park
Korean Journal of Metals and Materials.2021; 59(6): 404.     CrossRef