Initial Behavior of Additives and Mechanical Properties of Copper Foils on High Current Density
Tae-Gyu Woo, Jong-Jae Park, Il-Song Park
Korean J. Met. Mater.. 2021;59(5):304-313.   Published online 2021 Apr 6     DOI: https://doi.org/10.3365/KJMM.2021.59.5.304
Citations to this article as recorded by Crossref logo
Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
Tae-Gyu Woo, Il-Song Park
Korean Journal of Metals and Materials.2021; 59(6): 404.     CrossRef