| Home | E-Submission/Review | Sitemap | Editorial Office |  
top_img
Korean Journal of Metals and Materials Search > Browse Articles > Search



Study on the Effect of the Thiourea on Nano-Mechanical Properties and Microstructures of the Electroformed Thin Ni-P Foil
Moo Young Jung, Chang Su Nam, Byung-Sik Lee, Yong Choi
Korean J. Met. Mater. 2020;58(1):1-6.   Published online 2020 Jan 1
DOI: https://doi.org/10.3365/KJMM.2020.58.1.1

Abstract
The effect of thiourea on the nano-mechanical and chemical properties of Ni-P foil was studied to develop a high performance Ni-P deposit for automobile and machinery parts. The Ni-P deposit was prepared by electroforming in a modified sulphate bath with different amounts of thiourea. Chemical analysis of the electrodeposited Ni-P..... More

                   Web of Science 3  Crossref 4
Pulsed Electrodeposition of Thin Cobalt Coating Layer on Ferritic Stainless Steel for SOFC Interconnects
Suk-Chul Kwak, Byung Kyu Kim, Dong-Ik Kim, Young Whan Cho
Korean J. Met. Mater. 2017;55(11):768-776.   Published online 2017 Oct 31
DOI: https://doi.org/10.3365/KJMM.2017.55.11.768

Abstract
A thin, compact, and uniform cobalt layer was coated on ferritic stainless steel (Crofer 22 APU) by high frequency square pulsed electrodeposition in an aqueous solution containing cobalt chloride and boric acid. The effects of various electrodeposition parameters and post heat treatment on the morphology, thickness, roughness and adhesion of..... More

    
1 |
E-Submission
Email Alert
Author's Index
Specialties
Journal Impact Factor 1.2
The Korean Institute of Metals and Materials
SCImago Journal & Country Rank
Scopus
GoogleScholar
Similarity Check
Crossref Cited-by Linking
KOFST
COPE
Editorial Office
The Korean Institute of Metals and Materials
6th Fl., Seocho-daero 56-gil 38, Seocho-gu, Seoul 06633, Korea
TEL: +82-2-557-1071   FAX: +82-2-557-1080   E-mail: metal@kim.or.kr
About |  Browse Articles |  Current Issue |  For Authors and Reviewers
Copyright © The Korean Institute of Metals and Materials.                 Developed in M2PI