Abstract
We have developed an encapsulation technology for OLED devices using an LMPA sealing line to enhance barrier characteristics against moisture and oxygen penetration. To verify the potential of this technology for flexible OLED devices, three experimental factors were investigated in this study. First, the stability of the sealing line on..... More

Abstract
Encapsulation of the flexible OLED devices requires a low temperature process and great barrier characteristics against the permeation of water vapor and oxygen. We suggest a new OLED encapsulation method for the flexible OLED device using a sealing line instead of the TFE encapsulation. For the experiments, polyimide substrate with..... More

Abstract
The boron alkali molybdate glass system was investigated as lead-free low-temperature melting sealing materials, with different boron oxide contents between 0 and 8 mol%. The glasses were characterized using X-ray diffraction (XRD), differential scanning calorimetry (DSC), infrared spectroscopy (IR), and by densities. Their chemical properties were measured by their dissolution..... More