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Thermal Properties of Copper Matrix-Ceramic Filler Composite Prepared by Polymer Solution Method
Bok-Hyun Oh, Chung-Il Ma, Ji-Yeon Kwak, Heon Kong, Sang-Jin Lee
Korean J. Met. Mater. 2022;60(1):68-75.   Published online 2021 Dec 10
DOI: https://doi.org/10.3365/KJMM.2022.60.1.68

A copper (Cu) metal-ceramic filler composite with high thermal conductivity and a suitable thermal expansion coefficient was designed for application as a high-performance heat dissipation material. The purpose of the designed material was to utilize the high thermal conductivity of Cu while lowering its high coefficient of thermal expansion by..... More

Effect of Via Pitch on the Extrusion Behavior of Cu-filled TSV
Seho Kee, Wonjoong Kim, Jaepil Jung, Minhyung Choi
Korean J. Met. Mater. 2018;56(6):449-458.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.449

In this study, the extrusion behavior of Cu fill material in a through-Si-via (TSV) subjected to thermal loading was investigated. The Cu filling of the TSV was accomplished using pulse periodic reverse (PPR) electroplating. To study the extrusion, TSVs of varying via pitch were filled with Cu by electroplating. Defect-free Cu..... More

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