Abstract
We demonstrated a bonding technology using polyethyleneimine (PEI) as a bonding layer between printed Ag electrodes and an emission material layer (EML) to fabricate all-solution-processed Organic LightEmitting Diodes (OLEDs). We manufactured Ag electrodes on a glass substrate by the screen printing method, which was bonded to another substrate with ITO..... More

Abstract
We have developed an encapsulation technology for OLED devices using an LMPA sealing line to enhance barrier characteristics against moisture and oxygen penetration. To verify the potential of this technology for flexible OLED devices, three experimental factors were investigated in this study. First, the stability of the sealing line on..... More

Abstract
Encapsulation of the flexible OLED devices requires a low temperature process and great barrier characteristics against the permeation of water vapor and oxygen. We suggest a new OLED encapsulation method for the flexible OLED device using a sealing line instead of the TFE encapsulation. For the experiments, polyimide substrate with..... More

Abstract
To ensure the reliability of high-power light-emitting diode (LED) bulbs, temperature management is very important, including reduction of the junction temperature on the LED chip and enhancing outward thermal dissipation. Simulation can be an effective tool for predicting the temperature distribution over all bulbs, which enables a quantitative analysis. In..... More