Yiseul Kim, Jeehye Kwon, Dayoung Yoo, Sungkyu Park, Dajeong Lee, Dongyun Lee김이슬, 권지혜, 유다영, 박성규, 이다정, 이동윤
Korean J. Met. Mater.
2017;55(3):165-172. Published online 2017 Mar 3
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion..... More