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Korean J. Met. Mater.
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Korean Journal of Metals and Materials
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Discrepancies in Nanoindentation Hardness and Modulus with a Berkovich, a Cube-corner, and a Conical Tip in a Cu(In,Ga)Se
2
Light-Absorption Layer
Berkovich 압자와 Cube-corner 및 Conical shape 압자를 이용해서 얻은 Cu(In,Ga)Se
2
광흡수층 박막의 탄성계수 및 경도의 불일치에 대한 고찰
Yeojin Kang, Wonjung Park, Mao Zhang, Dayoung Yoo, Dongyun Lee강여진, 박원정, 장마오, 유다영, 이동윤
Korean J. Met. Mater.
2022;60(12):884-891. Published online 2022 Nov 25
DOI:
https://doi.org/10.3365/KJMM.2022.60.12.884
Abstract
In this study, we tried to understand the difference in the mechanical properties (elastic modulus, E & hardness, H) values of CIGS compound semiconductors measured using the Berkovich indenter and the sharper cube corner and conical indenter. Adopted continuous stiffness measurement technique to characterize it along with the indentation depth......
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Mechanical Behavior of Spin-Coated Sb
2
S
3
light Absorption Thin Films
스핀 코팅법에 의한 Sb
2
S
3
광흡수층 박막의 기계적 거동
Mao Zhang, Dayoung Yoo, Youngseon Jeon, Dongyun Lee장마오, 유다영, 전영선, 이동윤
Korean J. Met. Mater.
2021;59(1):1-7. Published online 2021 Jan 5
DOI:
https://doi.org/10.3365/KJMM.2021.59.1.1
Abstract
To measure the mechanical properties of Sb
2
S
3
, a two-component compound semiconductor used in the light absorption layer of a solar cell, Sb
2
S
3
thin films were formed on FTO glass using the spin coating method. The spin-coated Sb
2
S
3
thin films were heat-treated at 200
o
C in an Ar atmosphere for up.....
More
Web of Science 3
Crossref 3
Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate
Cu-Sn계 솔더와 기판 사이의 Ni층의 두께와 열처리 시간에 따른 금속간화합물의 기계적 특성
Yiseul Kim, Jeehye Kwon, Dayoung Yoo, Sungkyu Park, Dajeong Lee, Dongyun Lee김이슬, 권지혜, 유다영, 박성규, 이다정, 이동윤
Korean J. Met. Mater.
2017;55(3):165-172. Published online 2017 Mar 3
DOI:
https://doi.org/10.3365/KJMM.2017.55.3.165
Abstract
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion.....
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Crossref 2
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