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Mechanical Behavior of Spin-Coated Sb2S3 light Absorption Thin Films
스핀 코팅법에 의한 Sb2S3 광흡수층 박막의 기계적 거동
Mao Zhang, Dayoung Yoo, Youngseon Jeon, Dongyun Lee
장마오, 유다영, 전영선, 이동윤
Korean J. Met. Mater. 2021;59(1):1-7.   Published online 2021 Jan 5
DOI: https://doi.org/10.3365/KJMM.2021.59.1.1

To measure the mechanical properties of Sb2S3, a two-component compound semiconductor used in the light absorption layer of a solar cell, Sb2S3 thin films were formed on FTO glass using the spin coating method. The spin-coated Sb2S3 thin films were heat-treated at 200 oC in an Ar atmosphere for up..... More

Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate
Cu-Sn계 솔더와 기판 사이의 Ni층의 두께와 열처리 시간에 따른 금속간화합물의 기계적 특성
Yiseul Kim, Jeehye Kwon, Dayoung Yoo, Sungkyu Park, Dajeong Lee, Dongyun Lee
김이슬, 권지혜, 유다영, 박성규, 이다정, 이동윤
Korean J. Met. Mater. 2017;55(3):165-172.   Published online 2017 Mar 3
DOI: https://doi.org/10.3365/KJMM.2017.55.3.165

Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion..... More

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