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A Study on the Microstructure, Tensile and Fatigue Properties of Martensitic Stainless Steel Plate
Hyojoo Lee, Sam Yaw Anaman, Nam-Su Rho, Si-Hyun Sung, Hyun-Min Sung, Sang-Yeob Lee, Hoon-Hwe Cho
Korean J. Met. Mater. 2023;61(11):815-823.   Published online 2023 Oct 29
DOI: https://doi.org/10.3365/KJMM.2023.61.11.815

Abstract
The microstructure, tensile and fatigue properties of a martensitic stainless steel (MSS) plate with a thickness of 0.152 mm are investigated in this study. The microstructural properties were initially studied using electron backscatter diffraction microscopy. High dislocation densities were observed in the microstructure, along with the rolling texture revealed by..... More

                
Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current
알루미늄-구리 이종 도체 접합부에서 직류 전기 인가에 따른 금속간화합물의 성장 거동
Jeong-Ik Kim, Sung-woo Jin, Jinwook Jung, Hyun-Min Sung, Hye-Jin Jeong, Siwook Park, Ju-Won Park, Heung Nam Han
김정익, 진성우, 정진욱, 성현민, 정혜진, 박시욱, 박주원, 한흥남
Korean J. Met. Mater. 2017;55(6):372-378.   Published online 2017 Jun 1
DOI: https://doi.org/10.3365/KJMM.2017.55.6.372

Abstract
Aluminum conductors are increasingly replacing copper because Al has lower cost and lighter weight, and consequently the demand for Al-Cu joints for industrial applications is growing. However, an intermetallic compound is known to grow at the Al-Cu interface, and will result in fracture if it grows above a critical thickness...... More

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