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Effects of Rotation Speed on Microstructure and Mechanical Properties in Ti/Cu Dissimilar Friction Stir Welding
Ti/Cu 이종 마찰 교반 용접 시 미세조직과 기계적 특성에 미치는 회전속도의 영향
Yong-Jae Lee, Won-Ki Jung, Se-Eun Shin, Dong-Geun Lee
이용재, 정원기, 신세은, 이동근
Korean J. Met. Mater. 2021;59(12):886-892.   Published online 2021 Nov 19
DOI: https://doi.org/10.3365/KJMM.2021.59.12.886

Abstract
The dissimilar welding of titanium and copper by fusion welding is very difficult because the melting points of the materials are very highly different and strong brittle intermetallic compounds (IMCs) can be easily produced in welded zone and heat-affected zone, etc. Friction stir welding was employed as a type of..... More

                        
Effect of Sn Content on Filler and Bonding Characteristics of Active Metal Brazed Cu/Al<sub>2</sub>O<sub>3</sub> Joint
Jioh Shin, Ashutosh Sharma, Do-hyun Jung, Jae Pil Jung
Korean J. Met. Mater. 2018;56(5):366-374.   Published online 2018 May 8
DOI: https://doi.org/10.3365/KJMM.2018.56.5.366

Abstract
This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/ Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and..... More

         Cited By 10
Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측
Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
허민혁, 강남현, 박성훈, 김준기, 홍원식
Korean J. Met. Mater. 2016;54(12):908-915.   Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.908

Abstract
The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly..... More

         Cited By 4
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