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Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
JGB 첨가제에 의한 동박의 미세구조변화와 전기적 특성
Tae-Gyu Woo, Il-Song Park
우태규, 박일송
Korean J. Met. Mater. 2021;59(6):404-411.   Published online 2021 May 26
DOI: https://doi.org/10.3365/KJMM.2021.59.6.404

Extremely thin film high quality copper foil is required to ensure high performance in electronics and slimness in secondary batteries. During the electroplating of copper foil, Janus Green B(JGB) and Collagen were introduced as additives to the electrolytes to study their effects. The structural and electrical properties of the electroplated..... More

                           Cited By 1
Initial Behavior of Additives and Mechanical Properties of Copper Foils on High Current Density
고전류밀도에서의 첨가제 초기 거동 및 동박의 기계적 특성
Tae-Gyu Woo, Jong-Jae Park, Il-Song Park
우태규, 박종재, 박일송
Korean J. Met. Mater. 2021;59(5):304-313.   Published online 2021 Apr 6
DOI: https://doi.org/10.3365/KJMM.2021.59.5.304

In this study, we studied the surface and mechanical properties of multiple additives as well as the initial plating properties of individual additives. With the individual additive groups, copper crystals tended to converge at a stage above the critical amount of additive. When chloride ions were added, large crystals formed..... More

                           Cited By 1
Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
고전류밀도에서 유기첨가제에 의한 구리 전착층의 전기적 특성 변화
Tae-Gyu Woo, Il-Song Park
우태규, 박일송
Korean J. Met. Mater. 2020;58(1):41-48.   Published online 2019 Dec 12
DOI: https://doi.org/10.3365/KJMM.2020.58.1.41

Electroplating has many economic advantages in producing copper foils. The easiest way to manufacture electroplated copper foil with various properties is to add appropriate additives. This study evaluated the surface properties, mechanical and electrical properties of copper foil electroplated in electrolytes containing the leveler JGB (Janus Green B). When the..... More

                           Cited By 1
Effect of Gelatin and Chloride Ions on the Mechanical Properties and Microstructural Evolution of Copper Foil
젤라틴 및 염소이온 첨가에 의한 구리 박막의 미세조직 및 기계적 특성 고찰
Tae-Gyu Woo, Man-Hyung Lee, Kyeong-Won Seol
우태규, 이만형, 설경원
Korean J. Met. Mater. 2018;56(7):518-523.   Published online 2018 Jul 5
DOI: https://doi.org/10.3365/KJMM.2018.56.7.518

This study investigated the crystal structure and mechanical properties of copper foil electroplated by adjusting gelatin and chloride ions from 0 to 100 ppm. There was increased formation of spherical crystals and surface roughness on the surface of the electroplated layer when the gelatin was added, and the direction of..... More

Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper
구리 전해도금 변수의 기계적 특성 및 표면 특성에 미치는 주 효과 분석
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
우태규, 박일송, 설경원
Korean J. Met. Mater. 2018;56(6):459-464.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.459

Electroplated copper has been used as wiring in electronic circuit boards and as cathode materials for secondary batteries, and its usage has expanded into the construction industry because of its convenient production and high economic value. During the electroplating process, various parameters, such as crystal phase and size, can affect..... More

                           Cited By 1
Electronic Materials
The Effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) Additives on the Surface Morphology and Mechanical Properties of Electrolytic Copper Foil
전해 동박의 표면 형상 및 기계적 물성에 미치는 SPS 첨가제 영향
Tae-Gyu Woo
Korean J. Met. Mater. 2016;54(9):681-687.   Published online 2016 Sep 5
DOI: https://doi.org/10.3365/KJMM.2016.54.9.681

In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there..... More

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